TAB CU CLAD SUBSTRATE
PI THICKNESS 75μm
AD THICKNESS 12μm
CU THICKNESS 18μm
MIN PITCH 40μm
Product Description
TAB CU CLAD PACKAGE SUBSTRATE FRONT VIEW & REAR VIEW
NI/AU PLATING FLY LEADS REVERSE SHAPING BEFORE AU-AU BONDING
TAB COPPER CLAD PACKAGE SUBSTRATE AU-AU BONDING
WITH TUNING FORK GYROSCRPE FRONT VIEW & REAR VIEW
TAB CU CLAD PACKAGE SUBSTRATE MASS PRODUCTION DELIVERY
