COF FILM FOR TFT
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 35μm
FOR SIEMENS OR JNJ
COF IC FOR LCD TV MODULE
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 40 μm
FOR LG OR SAMSUNG
COF IC FOR LCD TV MODULE
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 30μm
PLATING:SN PLATING
COF IC FOR LCD TV MODULE
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 25μm
FOR LG OR SAMSUNG
COF IC FOR LCD TV MODULE
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 40μm
FOR LG OR SAMSUNG
COF FILM FOR OLED
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 38μm
PLATING: NI/AU PLATING
COF FILM FOR OLED
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 40μm
PLATING: NI/AU PLATING
COF FILM FOR OLED
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 38μm
PLATING: NI/AU PLATING
COF FILM FOR OLED
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 45μm
PLATING: NI/AU PLATING
COF FILM AS CONNECTOR
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 35μm
PLATING: NI/AU PLATING
COF FILM AS CONNECTOR
PI THICKNESS 25μm
CU THICKNESS 12μm
MIN PITCH: 40μm
PLATING: NI/AU PLATING
TAB TAPE TAB PACKAGE IC
PI THICKNESS 75μm
AD THICKNESS 12μm
CU THICKNESS 18μm
MIN PITCH 60~80μm
TAB CU CLAD SUBSTRATE
PI THICKNESS 75μm
AD THICKNESS 12μm
CU THICKNESS 18μm
MIN PITCH 40μm
TAB Substrate For Tuning Fork Gyro
PI THICKNESS 75μm
AD THICKNESS 12μm
CU THICKNESS 18μm
MIN PITCH 40μm
COF IC FOR LCD TV
PI THICKNESS 38μm
CU THICKNESS 8μm
MIN PITCH: 45μm
FOR LG OR SAMSUNG
COF PUNCH/SINGULATION
REEL COF PUNCH MAX: 60mm*60mm
REEL COF PUNCH MIN: 20mm*10mm
PUNCH UNIT CYCLE TIME: 3 SECONDS
MASS PRODUCTION YIELD: 99%
Homray Micron Technology. All rights Reserved.
E-mail: jerry@homray-tech.com ; serena@homray-tech.com
M.P: +86-15366208370 ;